Applied Materials’ $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus’ U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea’s big bet; Apple’s processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.

Not all chiplets are interchangeable, and options will be limited.

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

China restricts U.S. processors; Samsung’s CXL, DRAM module and roadmap; ASML’s $2.7B retention bonus; U.S., Mexico partner up; Keysight’s $1.5B offer to Spirent; Lam’s new pulsed laser deposition; new OSAT center.

IC sales up; Taiwan’s quake; Japan’s big bets; Intel Foundry loss; edgeAI startup funding; smartphone market’s recovery; robots; data center security; NoCs in 3D.